DaoAI identifies visible open-solder defects using a pretrained AI model and 2D images. Use the supplied model directly, then fine-tune it with a small set of production samples when needed.
Open-solder detection in a 2D inspection image.
Color alone does not tell the whole story of a solder joint. Reflections and surface variation can make fixed color rules difficult to apply consistently.
Conventional color-based solutions judge solder joints against preset color ranges. But a change in color is not necessarily a defect, and a color match does not guarantee a good joint. This can lead to false calls, missed open-solder defects, and repeated threshold tuning.
DaoAI uses a model trained on representative open-solder defects to recognize visual patterns in 2D inspection images. The decision is not based on color limits alone.
Both are chip terminations in a 2D inspection image: one lead is soldered to its pad, the other is not. A color range set wide enough to pass the joint on the left passes the open joint on the right as well. That is where color-based inspection stops.
An open solder joint lacks a soldered connection between a component lead or termination and its pad. DaoAI identifies visible signs of these defects in 2D inspection images.
Start with the supplied model. You do not need to train a new model from scratch before your first inspection.
When your boards or process conditions differ, collect a small set of representative samples from your line and fine-tune the model locally for your application.
Model-training workflow.
Talk with a DaoAI engineer about your solder-joint samples and inspection requirements.
Open solder is one defect type. Inspection Coverage lists every defect the machine looks for on a board, and where each one is checked.
